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Features

Darbond® 6568（Chip-level）

Single component, high viscosity

170℃ fast curing, repairable, good toughness, high and low temperature resistance

Mainly used for filling protection of inverted chip

 

Darbond® 6563（Chip-level）

Single component, low viscosity

170℃ fast curing, repairable

Mainly used for filling protection of inverted chip


Product parameters
Product number
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